Polyamide resin composition and molded body
US9783677B2 · kind B2 · utility
2Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Apr 16, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2423/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The polyamide resin composition of the present invention contains (A) a polyamide resin, (B) a glass fiber including a compound having a carboxylic anhydride-containing unsaturated vinyl monomer, the compound being on at least a part of a surface of the glass fiber, and (C) a copolymer including a carboxylic anhydride-containing unsaturated vinyl monomer and having a glass transition temperature Tg of higher than 0° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.