Solventless functionalization, milling, and compounding process with reactive diluents
US9783681B2 · kind B2 · utility
1Cited by
12References
18Claims
0Family size
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Key dates
| Filing date | Oct 21, 2010 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Aug 9, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2367/06
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Methods of compounding nanoparticles with a resin, e.g., a curable resin and one or more surface modifying agents are described. The methods use wet milling technology, including both continuous and batch milling processes, and can be used to functionalize the nanoparticles and disperse the functionalized nanoparticles into the resin system in a single process. Methods of compounding curable resin systems containing reactive diluents are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.