Aqueous compositions of low abrasive silica particles
US9783702B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 19, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1409
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides aqueous chemical mechanical planarization (CMP) polishing compositions having a pH ranging from 2.5 to 5.3 and comprising a mixture of spherical colloidal silica particles and from 30 to 99 wt. %, based on the total weight of silica solids in the aqueous CMP polishing composition, of elongated, bent or nodular silica particles wherein the colloidal and elongated, bent or nodular silica particles differ from each other in weight average particle size (CPS) less than 20 nm, wherein at least one of the spherical colloidal silica particles and the elongated, bent or nodular silica particles contains one or more cationic nitrogen atoms. The present invention further provides methods of using the compositions in high downforce CMP polishing applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.