Floor panel
US9783995B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Feb 17, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24777
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A floor panel may include a substrate having a top side and a bottom side. A top layer may be provided on the substrate. The top layer may consist of a printed thermoplastic film and a thermoplastic transparent or translucent layer provided on the printed thermoplastic film. The top layer may be directly applied to the substrate using a glue layer available between the printed thermoplastic film and the top side of the substrate. The substrate may be an extruded synthetic material board including a filler selected from the group consisting of chalk, wood and sand. The substrate at least at two opposite edges may include coupling means provided in the extruded synthetic material board. The floor panel may have a thickness of 5 to 10 millimeters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.