Pattern structure and method of manufacturing the pattern structure
US9784896B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Jun 8, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 13, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2101/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A pattern structure includes a plurality of pattern structure units arranged substantially on a same plane, where each of the pattern structure units has a first surface and a second surface, which are opposite to each other, and a microstructure is defined on the first surface of each of the pattern structure units, and a flattening layer disposed on the second surface of each of the plurality of pattern structure units, where the flattening layer connects the pattern structure units with each other, and a vertical step difference exists between second surfaces of the pattern structure units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.