Package system with cover structure and method of operation thereof
US9785186B2 · kind B2 · utility
2Cited by
9References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2013 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 5, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A package system includes: an exostructure; a ceramic panel attached to the exostructure; and an internal device component housed in the exostructure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.