Patent · US Active

Deposit dissipating layer

US9785192B1 · kind B1 · utility

2Cited by

0References

20Claims

0Family size

Assignee

AMAZON TECHNOLOGIES, INC. · US

Inventors

SHAN-YONG CHENG · Los Altos, US
Sasirekha Kodialam · Livermore, US
Julie Marie Connors · San Francisco, US

Key dates

Filing date	Nov 1, 2013
Grant date	Oct 10, 2017
Priority date	—
Expiry date	Mar 16, 2035

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC03C17/23
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Described in this disclosure is a surface configured to break down deposits thereon. The surface may include breakdown structures, oleophilic structures, and hydrophilic structures. The oleophilic structures and hydrophilic structures are configured to disperse a deposit, such as fingerprint residue, to the breakdown structures. This dispersion increases the surface area of the deposit with respect to the breakdown structures, increasing the contact area between the two. The breakdown structures modify the deposit physically, chemically, or both, such that fragments are distributed into the ambient environment. The surface may be applied to portable electronic devices.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.