Structures and manufacturing methods for glass covered electronic devices
US9785299B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 26, 2012 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 4, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2202/28
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The disclosure is directed to electronic device displays which are constructed to withstand damage from an impact resistance test wherein a steel ball of 2 g having a diameter of 8 mm is dropped from a designated height greater than 1 ft, more preferably greater than 2 ft, even more preferably greater than 3 ft, still even more preferably greater than 4 ft, yet even more preferably greater than 5 ft and even more preferably greater than 6 ft. The displays are configured using, for example, ultrathin glass adhered to a base glass, wherein the adhesive layer is optimized for thinness and stiffness.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.