Capability attributes based application packaging
US9785424B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L67/34
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method and an apparatus for an application thinning mechanism are described. The thinning mechanism can select a subset of components from a universal application to assemble an application variant to be distributed and installed to a specific type of devices. The universal application may include every component, such as asset, resource or executable, built/developed for targeted device attributes to install one common application to multiple devices. For example, the thinning mechanism can use a trait vector associated with a type of devices to iterate through the components and identify assets to be included or packaged into in each target device specific application or application variant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.