Physics-based high-resolution head and neck biomechanical models
US9786092B2 · kind B2 · utility
4Cited by
1References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Feb 18, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30008
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Systems and methods are shown for developing physics-based high resolution biomechanical head and neck deformable models for generating ground-truth deformations that can be used for validating both image registration and adaptive RT frameworks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.