Electronic component package
US9786573B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Jul 8, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 8, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/068
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic component package includes: a core including a cavity, a first resin layer, a second resin layer and a reinforcing layer disposed between the first resin layer and the second resin layer; and an electronic component disposed in the cavity, wherein a thickness of the first resin layer is different from a thickness of the second resin layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.