Orthogonally hinged individualized memory module cooling
US9786578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Aug 17, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.