Light emitting diode package
US9786827B2 · kind B2 · utility
6Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8582
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.