Methods for fabricating an optoelectronic device
US9786843B2 · kind B2 · utility
1Cited by
3References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jun 19, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention relates to methods for fabricating an optoelectronic device, including: directly applying a printing ink composition to a patterning process, wherein the printing ink composition includes (1) at least one compound selected from the group of compounds represented by Chemical Formula 1, Chemical Formula 2, Chemical Formula 3, and mixtures thereof as disclosed herein in an amount of 0.01-90 wt % based on the total weight of the composition and (2) at least one material for an optoelectronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.