Headphones with slidable lead element in earphone housings
US9788100B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 6, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 31, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R5/0335
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A headphone with over the head passage and two earphone housings is provided, with one housing attached at each end of the over the head passage at attachment areas thereof, and an electrical lead element passing between the over the head passage and the earphone housing. The over the head passage is connected at the attachment area to an earphone housing at an earphone attachment site arranged externally of the earphone housing, and the earphone housing comprise a lead element opening spaced from the earphone attachment site. The lead element opening is larger than the electrical lead element and the lead element is slidably arranged in the lead element opening.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.