Patent · US Active

Component having a micromechanical microphone pattern

US9788124B2 · kind B2 · utility

1Cited by

3References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Christoph Schelling · Stuttgart, DE
Stefan Singer · Vaterstetten, DE
Jochen Zoellin · Memmingen, DE

Key dates

Filing date	Aug 23, 2016
Grant date	Oct 10, 2017
Priority date	—
Expiry date	Aug 23, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Measures are provided for increasing the resistance to compression of a component having a micromechanical microphone pattern. In particular, the robustness of the microphone pattern to highly dynamic pressure fluctuations is to be increased, without the microphone sensitivity, i.e. the microphone performance, being impaired. The microphone pattern of such a component is implemented in a layer construction on a semiconductor substrate and includes at least one acoustically active diaphragm, which spans a sound hole on the substrate backside, and a stationary acoustically penetrable counterelement having through hole openings, which is situated above/below the diaphragm in the layer construction. At least one outflow channel is developed which makes possible a rapid pressure equalization between the two sides of the diaphragm. In addition, at least one controllable closing element is provided, with which the at least one outflow channel is optionally able to be opened or closed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.