Arrangement for connecting
US9788414B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 20, 2016 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Oct 20, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0084
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An arrangement for connecting a sensor assembly and a cable assembly. The arrangement includes a signal wire. The arrangement includes a transversely-extending insulating barrier. The signal wire extends through the insulating barrier. The arrangement includes a shield wire that is configured to provide at least part of a grounding pathway. The shield wire extends through the insulating barrier at a location spaced from the signal wire. The arrangement includes at least one conductive layer that is located upon the insulating barrier. The at least one conductive layer is spaced away from the signal wire and is in electrical contact with the shield wire. At least a portion of the insulating barrier has a non-linear profile. At least a portion of the at least one conductive layer that is located upon the at least a portion of the insulating barrier has the non-linear profile.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.