Housing, electronic device using same, and method for making same
US9788431B2 · kind B2 · utility
0Cited by
5References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 13, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 10, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/3481
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A housing includes a metal substrate, an adhesive layer formed on the metal substrate, and a resin film formed on the adhesive layer, the metal substrate, the adhesive layer and the resin film cooperatively form a cavity through a stamping process, an internal structure needed by the housing is formed in the cavity through an injection process, and the internal structure is formed on the resin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.