Heatsink providing equivalent cooling for multiple in-line modules
US9788460B2 · kind B2 · utility
3Cited by
13References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2015 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Dec 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/066
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heatsink structure cools a first electronic chip and a second electronic chip that are positioned serially and in-line to one or more cooling fan, such that cooling air from the cooling fan(s) passes above the first electronic chip before passing above the second electronic chip. The heatsink structure includes a first heatsink and a second heatsink, which are identical to each other, and which fit adjacent to one another when a first heatsink is rotated 180 degrees relative to the second heatsink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.