Apparatus and methods related to ground paths implemented with surface mount devices
US9788466B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 14, 2014 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are apparatus and methods related to ground paths implemented with surface mount devices to facilitate shielding of radio-frequency (RF) modules. In some embodiments, a module can include a packaging substrate configured to receive a plurality of components. The module can further include an RF component mounted on the packaging substrate and configured to facilitate processing of an RF signal. The module can further include an RF shield disposed relative to the RF component, with the RF shield being configured to provide shielding for the RF component. The RF shield can include at least one shielding-component configured to provide one or more electrical paths between a conductive layer on an upper surface of the module and a ground plane of the packaging substrate. The shielding-component can include a surface-mount device such as an RF filter implemented as a chip size surface acoustic wave (SAW) device (CSSD).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.