Component supply device
US9788470B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2012 |
| Grant date | Oct 10, 2017 |
| Priority date | — |
| Expiry date | Jul 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The component supply device includes a table on which a wafer sheet is carried and a pickup head which picks up a component on the wafer sheet carried on the table. The pickup head includes multiple component supply side suction nozzles, and a switching mechanism which switches the multiple component supply side suction nozzles between a pickup position at which the tip of the multiple component supply side suction nozzles faces down and a transfer position at which the tip of the multiple component supply side suction nozzles faces up. The arrangement of the multiple component supply side suction nozzles corresponds to the arrangement of multiple mounter side suction nozzles equipped on the mounting head of the mounter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.