Methods for mold release of body-mountable devices including microelectronics
US9789655B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2014 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Sep 29, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/00817
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A body-mountable device may include a first polymer layer, a second polymer layer, and a structure that includes a sensor between the first and second polymer layers. Fabricating the body-mountable device may involve providing a respective surface layer on each of one or more molding pieces, forming a first polymer layer, positioning the structure on the first polymer layer and then forming, between molding pieces, the second polymer layer over the structure positioned on the first polymer layer. The surface layer of each molding piece may facilitate release of the polymer layer or fabricated body-mountable device without disruption to the embedded structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.