Curing agents for low-emission epoxy resin products
US9790319B2 · kind B2 · utility
0Cited by
5References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Dec 20, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/5006
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to curing agents for epoxy resins, containing at least one adduct of trimethylhexamethylenediamine and cresyl glycidyl ether. The curing agent has a low viscosity and cures quickly together with epoxy resins even in moist, cold conditions and without blushing to form films with a high hardness and surface quality, which scarcely undergo yellowing upon exposure to light. It is particularly suited for low-emission room temperature-curing coatings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.