Dry bonding acrylate adhesive layers

US9790404B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Julen De Mendizabal Zalaikin · Barcelona, ES
• Elisabeth Torres Cano · Barcelona, ES
• Dennis Bankmann · Dressendorf, DE
• Roberto Pela · Düsseldorf, DE
• Sandra Niembro · Barcelona, ES
• Vincent Leon · Scottsdale, US

Key dates

• Filing date: Jun 20, 2014
• Grant date: Oct 17, 2017
• Expiry date: Jun 21, 2035

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/2891
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A radiation curable adhesive comprising (i) (meth)acrylic monomer(s) and/or oligomer(s), wherein said (meth)acrylic monomers or oligomers comprise 5 to 50 wt % of esters of (meth)acrylic acid with polyetherpolyols having the formula HO—((CH2)m—O)n—X wherein m=2, 3 or 4; n=2 to 50; X=H, linear, branched or aromatic C1 to C12-alkyl, the ester having a molecular weight from 150 to 2000 g/mol; (ii) non-reactive (co)polymer(s) based on unsaturated monomers, wherein said unsaturated monomers are selected from vinyl esters, (meth)acrylate esters and C2 to C8 unsaturated olefins, the (co)polymer having a molecular weight from 5000 g/mol to 500000 g/mol, such adhesive can form a solid adhesive layer after being cross-linked by radiation, the layer, has a non tacky surface but can be adhesively bonded under pressure to a second layer of the adhesive.