Light module
US9791140B2 · kind B2 · utility
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12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2014 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Sep 27, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S362/80
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.