Determining three-dimensional information from projections or placement of two-dimensional patterns
US9791267B2 · kind B2 · utility
Inventors
Key dates
| Filing date | May 12, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Nov 14, 2035 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61B2503/40
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Embodiments of a shape measurement system and related methods are disclosed. In some embodiments, the system places a two-dimensional initial pattern, which can be implemented as a standalone molding or can be attached to a light source or printed on an outfit, onto a surface of a three-dimensional object. The system captures a transformed version of the initial pattern in two dimensions that is distorted due to the varying depth of the surface. The system then analyzes the transformed pattern and derives three-dimensional information regarding the target object. The analysis, which can incorporate a calibration process, can rely on the projection nature of the light source, the isomorphism/non-isomorphism of the initial pattern, and other factors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.