Apparatus, system, and methods for weighing and positioning wafers
US9791309B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 13, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Jun 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S901/46
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus for characterizing a wafer comprising an aligner comprising a chuck for receiving and rotating the wafer, a sensor for detecting the position of the wafer as it is rotated, a first actuator for lowering and raising the wafer vertically, and a second actuator for moving the chuck horizontally; and a weighing scale comprising a weight sensor disposed proximate to the aligner, and a cantilevered arm extending laterally from the weight sensor over the chuck of the aligner, the cantilevered arm having a through hole surrounding the chuck. The chuck is vertically movable relative to the weighing scale from a first position in which the wafer is supported by the chuck to a second position in which the wafer is supported by the cantilevered arm of the weighing scale. A method for characterizing a wafer using the instant apparatus is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.