340 GHz multipixel transceiver

US9791321B2 · kind B2 · utility

Assignee

• CALIFORNIA INSTITUTE OF TECHNOLOGY · US

Inventors

• Goutam Chattopadhyay · Pasadena, US
• Ken B. Cooper · Orange, US
• Emmanuel Decrossas · Pasadena, US
• John J. Gill · La Cañada Flintridge, US
• Cecile D. Jung-Kubiak · Pasadena, US
• Choonsup Lee · La Palma, US
• Robert H. Lin · Chino, US
• Imran Mehdi · South Pasadena, US
• Alejandro Peralta · Tecate Mission Road, US
• Theodore Reck · Oak Ridge, US
• Jose V. Siles · Pasadena, US

Key dates

• Filing date: May 24, 2013
• Grant date: Oct 17, 2017
• Expiry date: May 23, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G01S7/036
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.