Integrated chip
US9791761B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 10, 2017 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Feb 10, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2203/07
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An integral chip is disclosed by embodiments of the present disclosure, including: two mono-mode vertical coupling gratings, two modulation modules, one 2×1 multi-mode interference coupler, and one dual-mode vertical coupling grating. The integral chip is capable of operating in dual wavelengths and dual polarization states by combination of polarization multiplexing and wavelength division multiplexing so as to realize modulation of complex formats and to enhance data modulation rate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.