Interposer and electronic component
US9792544B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Jan 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application provides an interposer, including an interposer substrate, at least one through silicon via, a first shield layer, a first insulation layer, a first cable layout layer, and at least one first bump. The interposer substrate includes an upper surface and a lower surface; the at least one through silicon via is buried in the interposer substrate and runs through the upper surface and the lower surface; the first shield layer is disposed on the upper surface of the interposer substrate and the first shield layer has electrical conductivity; the first insulation layer is disposed at the first shield layer; the first cable layout layer is disposed at the first insulation layer and is electrically connected to the at least one through silicon via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.