Electronic component termination and assembly by means of transient liquid phase sintering metallurgical bond
US9793057B2 · kind B2 · utility
12Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 9, 2016 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | May 14, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/435
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.