Use of vacuum chucks to hold a wafer or wafer sub-stack
US9793152B2 · kind B2 · utility
2Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2013 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Oct 2, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2551/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.