Patent · US Active

Use of vacuum chucks to hold a wafer or wafer sub-stack

US9793152B2 · kind B2 · utility

2Cited by
2References
20Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 28, 2013
Grant dateOct 17, 2017
Priority date
Expiry dateOct 2, 2034

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB32B2551/00
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Techniques are described for holding a wafer or wafer sub-stack to facilitate further processing of the wafer of sub-stack. In some implementations, a wafer or wafer sub-stack is held by a vacuum chuck in a manner that can help reduce bending of the wafer or wafer sub-stack.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.