Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device
US9793456B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 26, 2012 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Apr 26, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 μm to 10 μm, the glass transition temperature of the cured resin body is 10° C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of −50 to 250° C., a temperature elevation rate of 5° C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180° C. for 72 hours is 90% or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.