Packaging apparatus
US9793509B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 17, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Oct 28, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/421
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of the present invention provide a packaging apparatus, which relates to a preparing field of display technology and can solve a problem of the poor bonding state between a packaging cover plate and a substrate to be packaged, improving a quality of assembled product. The packaging apparatus comprises: an upper sealing unit and a lower sealing unit which have recesses and are movable towards each other to engage and form a cavity, wherein upper suction columns for fixing a packaging cover plate is disposed inside the recess of the upper sealing unit and a bearing table for bearing a substrate to be packaged is disposed inside the recess of the lower sealing unit, and seal glue is disposed on a face of the substrate to be packaged facing the packaging cover plate; a suction mechanism for vacuumizing the cavity; a leveling mechanism for adjusting a levelness of the packaging cover plate and/or the substrate to be packaged; a displacing mechanism for driving the packaging cover plate and/or the substrate to be packaged to move towards each other so that the packaging cover plate contacts the seal glue; an inflation mechanism for filling gas into the cavity after vacuumizin…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.