Ingress protection for reducing particle infiltration into acoustic chamber of a MEMS microphone package
US9794661B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2015 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Aug 7, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface-mountable MEMS microphone comprising a MEMS microphone die and an application-specific integrated circuit (ASIC) mounted inside a surface-mountable package housing, and fully enclosed therein. The surface-mountable package is a single, self-contained housing that provides an electrical interface to external circuitry for the enclosed MEMS microphone die and the ASIC, and provides electrical, physical, and environmental protection for the MEMS microphone die and the ASIC. The surface-mountable package allows external acoustic energy to enter the package interior via one or more acoustic ports and impinge on the diaphragm of the MEMS microphone die. The cover of the surface-mountable package comprises an acoustic port with ingress protection to limit dust and particle intrusion. The ingress protection can be a formed member that is part of the cover of the surface-mountable package having various shapes, an internal shield, or a combination of both a formed member and internal shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.