Thermal interface materials with thin film or metallization
US9795059B2 · kind B2 · utility
5Cited by
76References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 2013 |
| Grant date | Oct 17, 2017 |
| Priority date | — |
| Expiry date | Apr 28, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In one exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side and a dry material having a thickness of about 0.0001 inches or less. The dry material is disposed along at least a portion of the first side of the thermal interface material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.