Implantable electronic device employing fused thermoplastic-conductor subassembly and method of manufacturing the subassembly and the device
US9795796B2 · kind B2 · utility
5Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Mar 21, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2201/12
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.