Thermal print head
US9796189B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Dec 23, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/34
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal print head includes a semiconductor substrate, a resistor layer with heat generating portions arranged in the main scanning direction, a wiring layer included in a conduction path for energizing the heat generating portions, and a protective layer covering the resistor layer and the wiring layer. The semiconductor substrate includes a projection protruding from the obverse surface of the substrate and elongated in the main scanning direction. The projection has first and second inclined side surfaces spaced apart from each other in the sub-scanning direction. The heat generating portions are arranged to overlap with the first inclined side surface of the projection as viewed in plan view.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.