Microelectromechanical systems devices with improved reliability
US9796578B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Sep 30, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B3/0086
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
An electronic device may include components that are formed using microelectromechanical systems (MEMS) technology. A MEMS device may include a MEMS structure bonded to a semiconductor substrate. The MEMS structure may be formed from a silicon substrate having a cavity and a moveable member suspended over the cavity and free to oscillate within the cavity. The semiconductor substrate may be a complementary metal-oxide semiconductor substrate having circuitry such as sensing electrodes. The sensing electrodes may be used to gather signals that are produced by movement of the suspended member. One or more of the electrodes on the semiconductor substrate may be covered by a dielectric film to prevent electrical shorts between adjacent electrodes on the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.