Anisotropic conductive adhesive film and electronic device
US9796884B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 10, 2013 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Nov 13, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2984
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The invention provides an anisotropic conductive adhesive film and an electronic device. The anisotropic conductive adhesive film comprises a base film and microcapsule structures, wherein the microcapsule structures are set on the base film, and each of the microcapsule structures comprises a metallic conductive particle, a normal-temperature curable macromolecular polymer coated on the outside of the metallic conductive particle and a microcapsule wall coated on the outside of the macromolecular polymer, and an adhesive glue is adhered to the external surface of the microcapsule wall. When in use, the microcapsule structure is destroyed by pressurizing, the conductive particle and the normal-temperature curable macromolecular polymer contained inside the microcapsule wall leak out, and the normal-temperature curable macromolecular polymer leaked out is cured, so that electrical conduction and connection of a microelectronic apparatus can be achieved at normal temperature via the anisotropic conductive adhesive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.