Apparatus for applying a hot-melt adhesive to a substrate
US9797035B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 17, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Oct 7, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB05D5/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention relates to applying a liquid to pasty hot-melt adhesive to a substrate (44), comprising a template (29), having at least one cavity (38) for the hot-melt adhesive, and also comprising an adhesive-transfer infeed (33), which is assigned to the template (29) and through which the adhesive can be introduced into the cavity (38). The special feature consists in that the apparatus (10) further comprises a transporting-fluid-supply opening (35), assigned to the template (29), and a device for displacing (13, 15), in particular pivoting, the template (29) between a first position, in which the cavity (38) is assigned to the adhesive-transfer infeed (33), and a second position, in which the cavity (38) is assigned to the transporting-fluid-supply opening (35), and therefore the adhesive, in the second position, can be discharged from the cavity (38) by a transporting fluid flowing through the transporting-fluid-supply opening (35).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.