Expanded heat sink for electronic displays
US9797588B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 14, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Mar 14, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F2201/36
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Exemplary embodiments provide an electronic display assembly. One or more heat-generating components are preferably placed in thermal communication with a plate. One or more fans are placed to draw cooling air along the plate to remove the heat removed from the component. Some embodiments may place the plate behind the electronic image assembly, so that cooling air can remove heat from the plate as well as the electronic image assembly. Exemplary embodiments have power modules in thermal communication with optional conductive ribs. Conductive thermal communication is established between the optional ribs and the components in the exemplary embodiments.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.