Flow through MEMS package
US9798239B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Jun 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A flow through Micro-Electromechanical Systems (MEMS) package and methods of operating a MEMS packaged using the same are provided. Generally, the package includes a cavity in which the MEMS is enclosed, an inlet through which a fluid is introduced to the cavity during operation of the MEMS and an outlet through which the fluid is removed during operation of the MEMS, wherein the package includes features that promote laminar flow of the fluid across the MEMS. The package and method are particularly useful in packaging spatial light modulators including a reflective surface and adapted to reflect and modulate a light beam incident thereon. Other embodiments are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.