Method for coating a substrate

US9799554B2 · kind B2 · utility

Assignee

• SUSS MICROTEC LITHOGRAPHY GMBH · DE

Inventors

• Katrin Fischer · Stuttgart, DE
• Florian Palitschka · Gauting, DE
• Darren Southworth · Munich, DE
• William Whitney · Vergennes, US

Key dates

• Filing date: Apr 8, 2016
• Grant date: Oct 24, 2017
• Expiry date: Apr 8, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/76898
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for coating substrates provided with vias uses a first step in which the substrate is conditioned and a second step in which the substrate is coated with an electrically insulating material such that the vias are filled up completely.