Method for producing an electronic chip support, chip support and set of such supports
US9799598B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 18, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Nov 18, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method for producing at least one electronic chip support, from a plate that includes a first face intended to be in contact with a chip reader, a second face, covered with a first layer of electrically conductive material and intended to be linked to a radio antenna, and a core made from an electrically insulating material separating the first face from the second face. This method includes steps of drilling at least one through hole through the plate, depositing a layer of electrically conductive material on the first face and chemically etching a first electric circuit and a second electric circuit on the first face and the second face respectively. Prior to the chemical etching step, a step of depositing a third layer of electrically conductive material in the hole or holes, which covers the electrically insulating material in the corresponding hole or holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.