TFT array substrate, method of manufacturing the same and display device
US9799744B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 15, 2016 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Mar 15, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/601
Abstract
A method of manufacturing the TFT array substrate includes steps of: forming a first electrically conductive layer on the substrate, the first electrically conductive layer including a first electrically conductive pattern and a first signal line connected electrically to the first electrically conductive pattern located in a pixel region, and a first lead wire connected electrically to the first signal line; forming an insulation layer on the substrate formed with the first electrically conductive layer, the insulation layer including a first via-hole through which the first lead wire is exposed; and forming a second electrically conductive film on the substrate formed with the insulation layer, the second electrically conductive film being connected electrically to the first lead wire through the first via-hole in the insulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.