Audio driver assemblies, headphones including the audio driver assemblies, and related methods
US9800978B2 · kind B2 · utility
1Cited by
4References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 18, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Dec 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R11/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An audio driver assembly comprises a driver housing and an audio driver secured within the driver housing. The audio driver comprises a magnet assembly, a flexible diaphragm overlying the magnet assembly, and a stabilizer extending through the driver housing and into the magnet assembly. A headphone and a method of forming a headphone are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.