Methof of forming an integrated composite structure
US9801276B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Nov 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4697
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system and method according to one or more embodiments are provided to integrate circuits and/or circuit elements within a structure to form an electronically and/or physically integrated composite structure. For example, a circuit formed on a planar polymer substrate may be conformed to and electrically coupled to a forming structure in a single fabrication step. In one example, a forming structure formed and/or fabricated using an additive manufacturing process includes a contoured surface. A circuit is formed on a planar polymer substrate. The polymer substrate is deformed by environmental stress to substantially conform to the contoured surface of the forming structure and physically and/or electrically couple the circuit on the polymer substrate to a circuit formed on the forming structure. Additional systems and methods are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.