Bellows interconnect
US9801277B1 · kind B1 · utility
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13References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Aug 8, 2014 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Aug 8, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49169
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.