Electrical contacts in layered structures
US9801287B2 · kind B2 · utility
1Cited by
5References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2015 |
| Grant date | Oct 24, 2017 |
| Priority date | — |
| Expiry date | Oct 5, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/28
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Provided herein are layered structures and methods for forming the same, the layered structures including a conductive layer and an overcoat layer formed on a surface thereof, one or more electrical contacts formed on the surface of the conductive layers and via openings extending through the overcoat layer and reaching the electrical contacts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.